Dr. Hemanth Kumar Cheemalamarri | Microelectronics | Young Scientist Award

Scientist, Institute of Microelectronics, A*STAR Singapore.

Hemanth Kumar Cheemalamarri is an accomplished research scientist with expertise in semiconductor device physics and technology. Currently serving as a Scientist at the Institute of Microelectronics (IME), A*STAR, Singapore, Hemanth specializes in low thermal budget bonding technologies, process integration strategies for 3D ICs, and MEMS packaging. His work focuses on advancing bonding processes such as hybrid bonding, fusion bonding, and eutectic bonding. With extensive experience in semiconductor processing and material characterizations, he is dedicated to innovating processes for industrial adaptability. 🌍🔬

Publication Profile

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Education:

Hemanth completed his Ph.D. in Electrical Engineering from the Indian Institute of Technology Hyderabad (IITH) in 2021, where his thesis focused on low thermal budget bonding for quartz resonators and inter-die cooling applications. He also holds a B.Tech in Electronics & Communication Engineering from Jawaharlal Nehru Technological University Anantapur, with a strong academic background in digital modulation schemes. 📚🎓

Experience:

Hemanth’s current role as a Scientist at IME-A*STAR involves technology development, project execution, and process innovations across a variety of semiconductor fabrication techniques. He has led projects in bonding process development for MEMS applications, developed novel etching processes, and pioneered technologies such as Cu/Dielectric bonding for C2W applications. He has contributed to industrial projects and is a principal investigator for the UIBR grant. 🛠️🔧

Awards and Honors:

Hemanth has received numerous awards, including the GEM award for his exceptional contributions at IME, Visvesvaraya Fellow recognition for his doctoral studies, and the Best Poster Award at the 19th International Workshop on Physics of Semiconductor Devices (IWPSD). He has been honored with multiple research excellence awards at IIT Hyderabad and has received prestigious travel grants for international conferences. 🏅🏆

Research Focus:

Hemanth’s research is primarily focused on low thermal budget bonding technologies and process integration for 3D ICs. He has developed advanced techniques in hybrid bonding, fine-pitch bonding, and wafer-to-wafer (W2W) integration. His work has contributed to enhancing manufacturing efficiency in the semiconductor industry, particularly for MEMS applications and 3D device stacking. 🧠💡

Conclusion:

Hemanth Kumar Cheemalamarri’s interdisciplinary expertise, research contributions, and leadership in semiconductor technology have made him a valuable asset in advancing cutting-edge bonding processes. With a strong commitment to research excellence and industrial application, Hemanth continues to drive innovation in the field of microelectronics. 🔍🚀

Publications:

Damascene-compatible low thermal budget fine-pitch copper hybrid bonding with ultra-thin surface passivation
Published in SSDM 2023
Cited by: 12
Link to publication

Low thermal budget oxide-oxide bonding with thin dielectric interlayer
Published in EPTC 2023
Cited by: 15
Link to publication

FEM Study of Cu Pad Expansion with Surrounded Dielectrics for Hybrid Bonding
Published in EPTC 2023
Cited by: 10
Link to publication

Fine Pitch Al-Al Bonding at CMOS Compatible Thermal Budget
Published in ECTC 2023
Cited by: 20
Link to publication

Through Silicon Via Oxide Etch Back for Via-last Integration Scheme
Published in EPTC 2022
Cited by: 8
Link to publication